EMULATION TECHNOLOGY INTRODUCES DELUXE NO-LEAD SMD REMOVAL KIT

New no-lead, rework kit plays important role in eliminating lead from industry

SANTA CLARA, Calif., April 5, 2005 - Emulation Technology, Inc. (ET), the industry’s leading solution provider for adapters, sockets, and interconnect solutions introduces the Deluxe Chip Quik® No-Lead SMD Removal Kit. The kit is designed to assist engineers and technicians conducting SMT rework and removal of surface mount devices (SMDs). The Chip Quik removal method requires no expensive removal equipment, encouraging easy removal of QFPs, PLCCs, SOICs and other SMD chip components at safe, low temperatures under 300 degrees F using a standard soldering iron.

HOW IT WORKS

Removing surface mount devices with the Deluxe Chip Quik No-Lead SMD Kit is simple. The kit’s rework flux is applied to all leads of the device to be removed while a standard soldering iron is used to melt the no-lead Chip Quik removal alloy. The flux and alloy react with the existing solder to create and maintain a molten state. Once this state is achieved, the SMT device can be easily removed using precision tweezers or a vacuum pen, which are provided in the kit along with cleaning wipes, liquid flux remover and swaps to assist users in cleaning the PC board.

“Chip Quik no-lead SMD removal is a superior rework solution. Because it is no-lead, its applicability and value within the lab is amplified,” says Joe Bagliere, President of Emulation Technology.