EMULATION TECHNOLOGY INTRODUCES DELUXE NO-LEAD SMD REMOVAL KIT
New no-lead, rework kit plays important role in eliminating lead from
SANTA CLARA, Calif., April 5, 2005 - Emulation Technology, Inc. (ET), the
industry’s leading solution provider for adapters, sockets, and interconnect
solutions introduces the Deluxe Chip Quik® No-Lead SMD Removal Kit. The kit
is designed to assist engineers and technicians conducting SMT rework and
removal of surface mount devices (SMDs). The Chip Quik removal method
requires no expensive removal equipment, encouraging easy removal of QFPs,
PLCCs, SOICs and other SMD chip components at safe, low temperatures under
300 degrees F using a standard soldering iron.
HOW IT WORKS
Removing surface mount devices with the Deluxe Chip Quik No-Lead SMD Kit is
simple. The kit’s rework flux is applied to all leads of the device to be
removed while a standard soldering iron is used to melt the no-lead Chip
Quik removal alloy. The flux and alloy react with the existing solder to
create and maintain a molten state. Once this state is achieved, the SMT
device can be easily removed using precision tweezers or a vacuum pen, which
are provided in the kit along with cleaning wipes, liquid flux remover and
swaps to assist users in cleaning the PC board.
“Chip Quik no-lead SMD removal is a superior rework solution. Because it is
no-lead, its applicability and value within the lab is amplified,” says Joe
Bagliere, President of Emulation Technology.
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