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ET 2300
Surface Mount
IC Development Sockets
The ET 2300 line is a spring pin based socket system that operates at up to 23 GHz with –1dB of insertion loss. This new socket system allows the user to test and debug any BGA, QFN, QFP or other custom packages with lead pitches down to 0.5mm. Applications include development, debug, hand test, programming, test of ASIC or FPGA’s, package and chip qualification, production prototype, failure analysis and high volume production use. This socket system also gives engineers a method to test high-speed packaged semiconductors at an economical price.
HOW DOES IT WORK?
The ET 2300 has 3 target board mounting methods; compression mount, surface mount and thru-hole. The compression style mounts quickly and easily using four predefined tooling holes. The surface mount and thru-hole version both use a separate adapter that is solder mounted to the customer’s target printed circuit board. The socket is then mechanically secured to the adapter.
Two retention systems are available for this socket; Easy KnobTM, suited for high rates of insertion and Easy ScrewTM for applications where the chip package is changed infrequently during the project life. A unique feature of this product is that the customer can buy both retention systems for the same socket and interchange in the lab as his needs change. The Easy ScrewTM retention system can be designed with an opening in the middle to accommodate die probing.
Features and Benefits
- Less than 1 nH self inductance for optimum signal integrity and at-speed operation
- Easy KnobTM retention system provides built in pressure plate
- Built-in mechanical stop, prevents chip damage
- Retention systems are interchangeable
- Minimum real estate required on each side of the chip package
- Up to 125,000 insertion cycles
- Fewer parts to assemble and less tools needed for assembly
- Rapid custom design capabilities
- Rush Delivery – Available for quotation
ADDITIONAL INFORMATION
TEST REPORTS
Electrical Specifications |
| Pitch: |
0.50mm to 0.65mm pitch |
0.95 for 0.8mm pitch |
1mm to 1.27mm pitch |
| Full Travel |
0.43mm |
0.50mm |
0.70mm |
| Contact Force |
26 gf |
26 gf |
19 gf |
| -1dB Bandwidth |
15GHz |
18GHz |
23GHz |
| Contact Resistance |
< 35 Ohm |
<30 Ohm |
<16 Ohm |
| Current (Free Air) |
2.9 amp |
3 amp |
4 amp |
| Self Inductance |
0.88 |
0.95 |
0.93 |
| Capacitance |
0.097 pF |
0.284 pF |
0.19 pF |
Mechanical Specifications |
| Pitch: |
0.50mm to 0.65mm pitch |
0.95 to 0.8mm pitch |
1mm to 1.27mm pitch |
| Contact Life |
125,000 cycles |
125,000 cycles |
125,000 cycles |
| Full Travel |
0.43mm |
0.50mm |
0.70mm |
| Contact Force |
26 gf |
26 gf |
19 gf |
Materials |
| Spring |
SS, Au plate |
| Stamped Contact |
BeCu, Au plate |
| Temperature Rating |
| Operating Temperature Range |
–55°C to +130°C |
Socket Examples
Please note that these sockets are typically made to order, and you are required to submit an IC package drawing in order to receive a quote.
Please contact us!
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FULL LINE CATALOG
