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Development, Test, and Burn-In IC Sockets

High-Speed BGA and Leaded-Component Chip Sockets

Easy Knob Configuration
Easy Knob
Configuration
Easy Screw Configuration
Easy Screw
Configuration
Custom Solutions
Custom
Solutions
Multi-Chip Sockets
Multi-Chip
Sockets

Standard-Speed BGA and Leaded-Component IC Sockets

Clam Shell
Clam Shell
Open Top
Open Top
ZIF BGA Screening
ZIF BGA Screening
Test Socket Receptables
Test Socket Receptacles
PGA
PGA
DIP
DIP
TSOP
TSOP

BGA & Leaded Component Socket to Pin Adapters

Flat Pin Array
Flat Pin Array
Base Package Emulators
Base Package Emulators
  • Production sockets are designed to socket an IC to a host PCB.
  • These solutions enable component replacement, including field upgrades, without desoldering and resoldering.
  • HiLo solutions include mating socket and pin arrays. Base package emulators provide BGA height flexibility through separate ordering of standard or extended height pin arrays.
BGA Extender
BGA Extender
HiLo BGA Socketing System and Area Array Module Connector
HiLo BGA Socketing System and Area Array Module Connector
HiLo BGA Socketing System and Area Array Module Connector
HiLo BGA Socketing System and Area Array Module Connector