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Development, Test, and Burn-In IC Sockets
High-Speed BGA and Leaded-Component Chip Sockets
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Easy Knob
Configuration
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Easy Screw
Configuration
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Custom
Solutions
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Multi-Chip
Sockets
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| Product Links |
IC Packages |
Bandwidth / Contacts |
Features |
| Multi-Chip Sockets |
Any IC
package |
Customer
defined |
- Reduces overall cost of burn-in system
- Significantly reduced tray loading and unloading times
- Compression mount socket to board; no soldering required
- Pitches as low as 0.4mm
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| ET3300 IC Sockets |
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10 GHz
Elastomer
contacts
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- Knob or screw closures
- Up to 60,000 insertions
- Lead pitches down to 0.1mm
- Package sizes up to 45mm x 45mm
- Compression, SMT, or through-hole PCB mounting
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| ET2300 |
Compression mount to PCB |
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23 GHz
Spring-pin
contacts
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- Knob or screw closures
- Up to 125,000 insertions
- Lead pitches down to 0.5mm
- Package sizes up to 50mm x 50mm
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| Surface mount to PCB |
| Through-hole mount to PCB |
| Custom Chip Sockets |
Any IC
package
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Customer
defined
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- Compression, SMT, or through-hole PCB mounting
- Wide range of closures available
- Any lead pitch or package size
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| Twist Lock |
- BGA
- LGA
- PGA
- CSP
- QFN/MLF
- SOIC
- QFP
- Custom
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3 GHz
Elastomer
contacts
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- Legacy solutions, contact factory for availability
- SMT, through-hole, and compression PCB mountings
- Lead pitches down to 0.5mm
- Any package size
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| Lever Lock |
| Knob Lock |
Standard-Speed BGA and Leaded-Component IC Sockets
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Clam Shell
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Open Top
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ZIF BGA Screening
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Test Socket Receptacles
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PGA
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DIP
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TSOP
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BGA & Leaded Component Socket to Pin Adapters
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Flat Pin Array
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Base Package Emulators
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- Production sockets are designed to socket an IC to a host PCB.
- These solutions enable component replacement, including field
upgrades, without desoldering and resoldering.
- HiLo solutions include mating socket and pin arrays. Base package
emulators provide BGA height flexibility through separate ordering
of standard or extended height pin arrays.
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BGA Extender
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HiLo BGA Socketing System and Area Array Module Connector
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| Product |
Description |
HiLo
BGA Socketing System
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Latest-generation, high-performance socketing system. Includes a socket
array that solders to the host PCB and a mating pin array that solders
to the BGA-mounted component. |
BGA Base Package
Emulators
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Socket array that solders to a host PCB. Designed to mate with a BGA flat
pin array or BGA extender. |
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BGA Flat Pin Array
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Standard-height pin array that solders to the BGA-mounted component. Designed
to mate with a base package emulator. |
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BGA Extender
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Extended-height pin array that solders to the BGA-mounted component. Designed
to mate with a base package emulator. |
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FULL LINE CATALOG
