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Bug Isolators
Cables, Connectors & Interconnect
Conversion Adapters
Die Attach & Packaging
Emulator Adapters
Field-Configurable Adapters
FPGA Development Systems
Heatsinks
Lab Tools & Rework Accessories
PC Hardware Connectivity
PCB/Flex Design & Assembly
Pogo Pins & Fixtures
Probing Solutions
Programming Adapters
Prototyping Adapters
Sockets & Receptacles

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Product Line

Bug Isolators  
Cables, Connectors & Interconnect  
Conversion Adapters
Die Attach & Packaging  
Emulator Adapters
Field-Configurable Adapters  
FPGA Development Systems  
Heatsinks  
Lab Tools & Rework Accessories
PC Hardware Connectivty Solutions  
PCB/Flex Design & Assembly
Pogo Pins & Fixtures  
Probing Solutions
Programming Adapters
Protoyping Boards & Adapters
Sockets & Socket Receptacles  

Bug Isolators

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Bug Isolators allow individual IC signals to be connected to or disconnected from the system.


PGA
PLCC
QFP

Cables, Connectors, and Interconnect

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Ribbon Cable & Connectors
D-Sub Connectors: D-Sub, Mini DIN, DVI, HDMI, Centronics, USB, IEEE 1394
Switches: DIP
Headers
Insulated Stud Covers
Insulated Board In-Sleeves
Insulating Shield Caps
Jumper Shunts
PCB Interconnect: IDC, PCI Card Edge, Flex Cable, Power, Pin Headers
Wire Wrap Posts
PC/104 & PC/104+ Connectors and Hardware
MICTOR High-Density Coaxial Cables and Connectors
Samtec High-Density Coaxial Cables and Connectors
Pogo Pin Based Custom Interconnect
HiLo Flexible Interconnect System
PLCC Plugs

Conversion Adapters

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ET's conversion adapters let you convert one form of a socket or IC(s) to another form.


Multi-Chip Modules
Reduce costs and enhance performance by isolating specific components onto a module.

Footprint Conversion/IC Obsolesence Solutions
Convert an IC available only in one package style or footprint to another without modifying your existing PCB.

RoHS Component Conversion Adapters
For those exempt from RoHS regulations and allowed to mix SnPb with RoHS compliant solder but are only able to procure product in RoHS compliant form, use a RoHS conversion adapter to convert it to SnPb and use only one reflow process in your assembly.

Cost Reduction Adapters
Reduce costs by converting an IC available only in one package style or footprint to another.

Socket Conversion Adapters
Convert a socket designed for one mounting style or footprint to another without modifying your existing PCB.

Socket Conversion Adapters - Off-the-Shelf

Upgrade Your MC68040 to an MC68060

Die Attach & IC Packaging

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ET has wire bonding and encapsulation capability for die attach to PCBs or flex circuits. We also have flip-chip with underfill expertise. ET can also package your die in application specific organic semiconductor packaging.


Die Attach
IC Packaging


Emulator Adapters

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Device-Specific Adapters    What do you mean by Device Specific?

PLCC - Clip-On
PQFP - Clip-On
Non-BGA Package Types - Socketable
Non-BGA Package Types - SMT
BGA - SMT

Wired 1-to-1 Adapters

PLCC - Clip-On
LCC, PGA, PLCC - Socketable
PQFP - Socketable
DIP Female to LAP - SMT
DIP Female to SOIC - SMT
DIP Female to SSOP, TSSOP - SMT
DIP Female to TSOP - SMT
PGA, PLCC, PQFP, SOIC, SSOP, TSOP - SMT
SDIP Female to SOIC - SMT
QFN/MLF (3-in-1 Adapter)
BPE/FPA BGA Emulator System
BPE BGA Emulator Bases
FPA BGA Emulator Pin-Fields (pads on top)
FPA-BL BGA Emulator Pin-Fields (solder balls on top)
XPA BGA Emulator Extended Length Pin-Field (pads on top)

Adapter Bases - Surface Mountable

BGA
PQFP
SSOP
TSOP
TSSOP
SOIC

Socket Adapters

Surface Mount Adapters - LAP ZIF Socket to LAP SMT Pads
Surface Mount Adapters - TSOP ZIF Socket to TSOP SMT Pads


PAL/EPROM Emulator Adapters

Female DIP to PLCC Pads
Female DIP to PLCC Sockets
Female DIP to SOIC Pads


Emulator Pods

Clip-On PQFP
Socketable LCC & PLCC Pods
Socketable PGA & PQFP Pods
Socketable PLCC (Compact Size) Pods
Surface Mount w/ Wire Wrap Posts - PQFP Pods

Emulator Pod Interconnect Systems

Surface Mount - Target Chip Adapters - PQFP
Emulator Plugs for PQFP Sockets

Emulator Pod Extenders

Socketable PGA Extenders

Field-Configurable Adapters

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Avoid high costs, NREs, and long lead-times by using pre-built adpaters. Just wire wrap the adapters according to your required configuration.


Emulator Adapters
Programming Adapters
All-Purpose Adapters

FPGA Based Development Systems

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Use an off-the-shelf development system to develop your new design, or use one of our custom ASIC emulators.


FPGA Based Development Systems
ASIC Emulation Modules

Heatsinks

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Heatsinks are available standalone or integrated with a socket system.


Elliptical-Fin Snap-On BGA Heatsinks
Round-Pin Snap-On BGA Heatsinks

Lab Tools & Rework Accessories

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Insertion/Extraction Tools

DIP
PGA
PLCC

Magnifying Glasses

Magnifying Glasses

Microscopes and Microscope Accessories

Microscopes and Microscope Accessories

Probes, Handheld

Microtip Probe to Stacking Banana Plug
Probe Set and Replacement Tips to Sheathed Banana Plug
0.3mm Lead Pitch Probe to Stacking Banana Plug
Extendable Tip Probe to Stacking Banana Plug
Spring-tip Probe to BNC Male
Various DMM Probes: High-Voltage, Alligator, Kits, etc.
Handheld DMM Cases & Accessories

Probe Stations (Hands-Free)

Probe Positioner, High Speed Signal
Probe Positioner, Standard
Probe Kits

Rework Solutions

BGA Reballing Preforms
BGA Stencils
Dummy Components - QFP, TQFP, BGA, SOIC, PLCC

Screwdrivers, Torque

Preset Torque Screwdriver
Adjustable Torque Screwdriver

SMD Clips

MicroClips (for SMD passive components)

SMD Removal Solutions

ChipQuik SMT/Through-Hole Device Low-Temperature Removal Alloy
Use a standard soldering iron to quickly and easily remove SMT or through-hole components without damaging the device, adjacent components or the PCB.
Desoldering Pumps

SMD, Solder Rework Systems

Battery Powered Soldering Iron
Portable Soldering Iron
Temperature Controlled Soldering Iron
Airbath Hot Air Reflow System
AirPencil Hot Air Reflow System
AirFountain Hot Air Reflow System

SMD Tweezers

Test Tweezer to BNC Male
Test Tweezer to Single Stacking Banana Plug

Test Instruments

Index page
Bench Top DMM
Bench Top Function Generators
Handheld Logic Probe
Handheld Component Testers
Handheld DMMs
Handheld Infrared Themometer
Handheld Short Circuit Detector

Vacuum Pens

Manual Vacuum Pen - Press-on Angled & Straight Tips
Manual Vacuum Pen - Screw on Tips
Powered Vacuum Pen
AirPick Vacuum Pen

Wire-Wrap Tools

Wire Wrap Tools (Cutters, Wire-Wrapping Guns, Bits, Sleeves and Wire)
Wire Wrap Posts


PCB & Flex Circuit Design, Manufacturing & Assembly

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In addition to conventional PCB assemblies, ET has flex and rigid flex circuit assembly expertise. Once your schematic is completed, we can handle the PCB/flex design, manufacturing, component mounting, and test.


PCB/Flex Circuit Design
PCB Assembly
Flex Circuit Assembly


PC Hardware Connectivity Solutions

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Use ET's PC & hardware connectivity solutions to add wireless connectivity to your lab's PCs and hardware and eliminate the wired mess in your lab!


Index page

CompactFlash to Bluetooth Adapter
Add Bluetooth to your laptop/PC via a CompactFlash card slot

PCMCIA/PCCARD to Bluetooth Adapter
Add Bluetooth to your laptop/PC via a PCMCIA/PCCARD slot

USB to Bluetooth Adapters
Add Bluetooth to your laptop/PC via a USB port

RS232 to Bluetooth Adapter
Add Bluetooth to your laptop/PC via an RS232 port

PCMCIA/PCCARD to RS232 Converter
Add one-or-two RS232 Serial Ports to your laptop/PC

PCMCIA/PCCARD to RS422/485 Converter
Add one-or-two RS422/485 Serial Ports to your laptop/PC

RS232 Bluetooth Module:
Convert your RS232 based product into a Bluetooth compatible product


Pogo Pins & Fixtures

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Use pogo pins to create your own custom interconnect or let ET do the work for you.


Pogo Pins
Pogo Pin Based Custom Fixtures, Adapters & Sockets

Probing Solutions

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Pre-Mounted Device Probing Solutions (Test Clips)

These solutions allow signal access to leaded ICs and components already mounted to PCBs


Package Specific Clips

DIP Spring Lock
PLCC Low Profile Friction Lock
PLCC-Test Clips
PQFP/TQFP Mechanical Lock EIAJ
PQFP/TQFP Mechanical Lock JEDEC
PQFP/TQFP Spring Lock EIAJ
SOIC Spring Lock
TSSOP/SSOP Spring Lock
TSOP Friction Lock
TSOP (Type II)

Generic Multiple Lead Access

QFP Wedge Clip
SSOP Wedge Clip

Individual Lead Access

SMD Grabbers (min 1.27mm Lead Pitch)

Grabber with 0.025" Square Pin
Grabber with BNC Male Plug
Grabber with Double Banana Plug
Grabber with Flexible Tip
Grabber with One or Two Ends
Grabber with Sheathed Banana Plug
Grabber with Stacking Banana Plug
Grabber with Ultra-Thin Shaft (One or Two Ends)
Grabber only
Flying Test Leads (Male to Female and Female to Female)

MicroGrippers (min 0.2mm Lead Pitch)

High Speed: 1-3GHz
Higher Speed: 5-10GHz
arrow Highest Speed: 10-15GHz
     For direct connect between Agilent or Tektronix test probes
     and high frequency signals on leaded chip packages.

For 0.2mm to 0.5mm Lead Pitch
For 0.5mm to 0.8mm Lead Pitch
For 0.3mm to 1.25mm Lead Pitch
Full Temperature (-55°C to 250°C)
Kelvin True Measure
Low-Cost Version
Lowest Conductor Resistance (1-2 mOhms), Lowest Profile (7mm Height)
Oscilloscope Probe Adapter Kit
30° Bendable Barrel

SMD Clips

MicroClips(for SMD passive components)


Socketed Device Probing Solutions (Bug Katchers)

These adapters mount to the PCB in place of the IC. The IC is placed into a socket on the adapter, which breaks out the signals.


CSP/µBGA
BGA - Generic
BGA - Device Specific
QFN/MLF (3-in-1 Adapter)
DFN/LAP
QFP/SSOP
SOIC
DIP
HGA
LCC
PGA
PGA Bug Isolator
PLCC
PLCC Bug Isolator
PQFP Socket Mount
QFP Bug Isolator


CSP Specific Solutions

These solutions are targeted towards CSP (Chip Scale Package) devices.


CSP Signal Access Tool


Mictor/Samtec Probing Solutions

These solutions adapt specific PCB footrpints to other forms.


MICTOR Adapters, Cables, Connectors and Accessories

MICTOR Index Page
MICTOR Bug Katcher

Samtec Adapters, Cables, Connectors and Accessories

Samtec Index Page
Samtec Bug Katcher

Agilent Pro Series Soft Touch Footprint Adapters

Pro Series Soft Touch Adapter


Agilent Logic Analyzer Solutions

These solutions interface your microprocessor to Agilent Logic Analyzers.


Agilent Pro Series Soft Touch Footprint Adapters

Pro Series Soft Touch Adapter

Agilent Logic Analyzer Adapters & Software

Programming Adapters

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Ordering Your Programming Adapter

Programming Adapter Index by Package Type

BGA
DataFlash
DIP
FLATPACK
LAP
MAP
LCC
QFN/MLF
QFN/MLF (3-in-1 Adapter)
PGA
PLCC
PQFP/TQFP
SDIP
SOIC
SOJ
SOT
SSOP
TSOP
TSSOP

Cross Reference by Chip-Type: Programmable Logic

Logic, Multi-Source    What does Multi-Source Mean?
(Good for IC Manufacturers: AMD, Atmel, Cypress, Harris, Lattice, National, Philips, Texas Instruments)

Cross Reference by Chip-Type: Programmable Memories

Memories, Multi-Source (Support for Multiple IC Manufacturers)

8K to 32K Memories
64K to 512K Memories
256K to 8MB Memories (8-bit) and Flash Memories
256K to 4MB Memories (16-bit)

Memories, IC Manufacturer-Specific

Atmel
Microchip
Mitsubishi
NEC
SEEQ
Wafer Scale Integration

DRAM Testing

Samsung Semiconductor

Microcontrollers

Multi-Source (Support for Multiple IC Manufacturers)
Motorola

Prototyping Boards, Adapters & Extender Cards

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Extender Cards


CompactPCI Backplanes
CompactPCI Extender Cards
PCI Extender Cards
PCMCIA/PCCARD Extender Cards
VME Extender Cards

Prototyping Boards (Printed Circuit Boards Only - User Configurable)


PCMCIA/PCCARD Prototyping Boards
BGA/QFN (0.50mm - 1.27mm Lead Pitch)
PLCC (50 mil spacing)
QFP (20 mil spacing)
QFP (25 mil spacing)
SOIC (50 mil spacing)
SOIC (50 & 25 mil spacing)
TSOP, PSOP, SSOP (30 mil spacing)
General Purpose Prototyping Boards
Test Fixture Boards

Prototyping Adapters (Fully Assembled)


BGA
DIP
EPROM/Flash Memory Adapters
Ericsson Bluetooth Prototyping Adapter
HGA (Interstitial)
LAP
LCC
MAP
MLF
PGA
PLCC
QFP
Shrink DIP
SOIC
SOJ
SSOP
TSOP
TSSOP
ZIP

QFN/MLF 3-in-1 Adapter System

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The QFN/MLF 3-in-1 Adapter System allows QFN/MLF programming, probing or emulation.


QFN/MLF 3-in-1 Adapter System

Sockets & Socket Receptacles

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Index Page

Socket Receptacles

Socket Receptacles allow sockets to be "socketed" and easily placed onto & removed from the PCB for reuse and cost savings.


Standard and Custom Receptacles for All Socket Types

Test & Burn-In Sockets

Test & Burn-In Sockets are through-hole mounted and typically use a clamshell or open-top lid.


BGA
Micro BGA
DIP
Flatpack (Military)
HGA (Interstitial)
LAP
LCC
MAP
MLF/QFN
PGA
PLCC
PQFP/TQFP
SDIP (Shrink DIP)
SOIC
SOJ
SOP
SOT
SSOP / TSSOP
TAP
TSOP

Development Sockets

ET Development Sockets are economical high-performance sockets targeted to the R&D phase of IC or system design and development.

Our ET 2300 and ET 3300 Development Socket lines are available for all package styles: uBGA, BGA, CSP, MLF/QFN, SOP, QFP, modules, die and custom packages. These economical sockets are available with 5, 7, 10 or 15-day expedited lead times, with a standard 5-week delivery. These sockets utilize our patented spring pin technology, providing a variety of retetion styles including Easy KnobTM and Easy ScrewTM, up to 23GHz bandwidth, heatsink options, and a list of other features. These are available for any package size, pin/ball count and pitch down to 0.5mm.

Compression Mount

Surface Mount

Thru Hole

Elastomer


Custom Development Sockets

Our "Custom Development Sockets" are custom designed to meet your requirements. These sockets are available for all package styles: uBGA, BGA, CSP, MLF/QFN, SOP, QFP, modules, die and custom packages. They are available for any package size, pin/ball count and pitch down to 0.3mm. The socket's contact element is optimized for the application. Various contact elements are available: pogo-pin, elastomer, capped spring, PCB embedded contact, etc. Custom designs give a multitude of options, including higher bandwidths, lower contact forces, meeting z-height requirements, etc.

Custom Development Sockets

Production Sockets


Production Sockets are meant to socket the IC in the end application. Some benefits are to allow field upgrades, eliminate the need to solder the IC after the assembly has been made, etc.


HiLo BGA Socketing System
BPE/FPA BGA Socketing System
BPE BGA Socket Bases
FPA BGA Socket Pin-Fields (top-side pads receive BGA)
FPA-BL BGA Socket Pin-Fields (top-side pads with solder balls receive BGA)
XPA BGA Socket Extended Length Pin-Field (top-side pads receive BGA)
SDIP (Shrink DIP)
DIP
LCC
PLCC
PQFP/TQFP
LCC
PLCC
PSOP
SOIC
SOJ
SSOP/TSSOP
TSOP/TSOPII

Male-to-Male

BGA
SDIP
DIP
HGA
PGA

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USB Microscope
Microscope
2.0MPixel Handheld
USB Digital

Hands-free flexible probe positioner
Probe Positioner
High Speed Signal

Quick, steady, and accurate hands-free probing.