Bug Isolators

Bug Isolators allow individual IC signals to be connected to or disconnected from the system.

Cables, Connectors, and Interconnect

Conversion Adapters

ET's conversion adapters let you convert one form of a socket or IC(s) to another form.

Die Attach & IC Packaging

ET has wire bonding and encapsulation capability for die attach to PCBs or flex circuits. We also have flip-chip with underfill expertise. ET can also package your die in application specific organic semiconductor packaging.

Emulator Adapters

Field-Configurable Adapters

Avoid high costs, NREs, and long lead-times by using pre-built adpaters. Just wire wrap the adapters according to your required configuration.

FPGA Based Development Systems

Use an off-the-shelf development system to develop your new design, or use one of our custom ASIC emulators.

Heatsinks

Heatsinks are available standalone or integrated with a socket system.

Lab Tools & Rework Accessories

Insertion/Extraction Tools

Magnifying Glasses

Microscopes and Microscope Accessories

Probes, Handheld

Probe Stations (Hands-Free)

Rework Solutions

Screwdrivers, Torque

SMD Clips

SMD Removal Solutions

SMD, Solder Rework Systems

SMD Tweezers

Test Instruments

Vacuum Pens

Wire-Wrap Tools

PCB & Flex Circuit Design, Manufacturing & Assembly

In addition to conventional PCB assemblies, ET has flex and rigid flex circuit assembly expertise. Once your schematic is completed, we can handle the PCB/flex design, manufacturing, component mounting, and test.

PC Hardware Connectivity Solutions

Use ET's PC & hardware connectivity solutions to add wireless connectivity to your lab's PCs and hardware and eliminate the wired mess in your lab!

Pogo Pins & Fixtures

Use pogo pins to create your own custom interconnect or let ET do the work for you.

Probing Solutions

Pre-Mounted Device Probing Solutions (Test Clips)

These solutions allow signal access to leaded ICs and components already mounted to PCBs

Package Specific Clips DIP Spring Lock PLCC Low Profile Friction Lock PLCC-Test Clips PQFP/TQFP Mechanical Lock EIAJ PQFP/TQFP Mechanical Lock JEDEC PQFP/TQFP Spring Lock EIAJ SOIC Spring Lock TSSOP/SSOP Spring Lock TSOP Friction Lock TSOP (Type II) Generic Multiple Lead Access QFP Wedge Clip SSOP Wedge Clip Individual Lead Access SMD Grabbers (min 1.27mm Lead Pitch) Grabber with 0.025" Square Pin Grabber with BNC Male Plug Grabber with Double Banana Plug Grabber with Flexible Tip Grabber with One or Two Ends Grabber with Sheathed Banana Plug Grabber with Stacking Banana Plug Grabber with Ultra-Thin Shaft (One or Two Ends) Grabber only Flying Test Leads (Male to Female and Female to Female) MicroGrippers (min 0.2mm Lead Pitch) High Speed: 1-3GHz Higher Speed: 5-10GHz Highest Speed: 10-15GHz      For direct connect between Agilent or Tektronix test probes      and high frequency signals on leaded chip packages. For 0.2mm to 0.5mm Lead Pitch For 0.5mm to 0.8mm Lead Pitch For 0.3mm to 1.25mm Lead Pitch Full Temperature (-55°C to 250°C) Kelvin True Measure Low-Cost Version Lowest Conductor Resistance (1-2 mOhms), Lowest Profile (7mm Height) Oscilloscope Probe Adapter Kit 30° Bendable Barrel SMD Clips MicroClips(for SMD passive components)

Socketed Device Probing Solutions (Bug Katchers)

These adapters mount to the PCB in place of the IC. The IC is placed into a socket on the adapter, which breaks out the signals.

CSP/µBGA BGA - Generic BGA - Device Specific QFN/MLF (3-in-1 Adapter) DFN/LAP QFP/SSOP SOIC DIP HGA LCC PGA PGA Bug Isolator PLCC PLCC Bug Isolator PQFP Socket Mount QFP Bug Isolator

CSP Specific Solutions

These solutions are targeted towards CSP (Chip Scale Package) devices.

CSP Signal Access Tool

Mictor/Samtec Probing Solutions

These solutions adapt specific PCB footrpints to other forms.

MICTOR Adapters, Cables, Connectors and Accessories MICTOR Index Page MICTOR Bug Katcher Samtec Adapters, Cables, Connectors and Accessories Samtec Index Page Samtec Bug Katcher Agilent Pro Series Soft Touch Footprint Adapters Pro Series Soft Touch Adapter

Agilent Logic Analyzer Solutions

These solutions interface your microprocessor to Agilent Logic Analyzers.

Agilent Pro Series Soft Touch Footprint Adapters Pro Series Soft Touch Adapter Agilent Logic Analyzer Adapters & Software

Programming Adapters

Ordering Your Programming Adapter

Programming Adapter Index by Package Type

BGA
DataFlash
DIP
FLATPACK
LAP
MAP
LCC
QFN/MLF
QFN/MLF (3-in-1 Adapter)
PGA
PLCC
PQFP/TQFP
SDIP
SOIC
SOJ
SOT
SSOP
TSOP
TSSOP

Cross Reference by Chip-Type: Programmable Logic

Logic, Multi-Source    What does Multi-Source Mean?
(Good for IC Manufacturers: AMD, Atmel, Cypress, Harris, Lattice, National, Philips, Texas Instruments)

Cross Reference by Chip-Type: Programmable Memories

Memories, Multi-Source (Support for Multiple IC Manufacturers)

8K to 32K Memories
64K to 512K Memories
256K to 8MB Memories (8-bit) and Flash Memories
256K to 4MB Memories (16-bit)

Memories, IC Manufacturer-Specific

Atmel
Microchip
Mitsubishi
NEC
SEEQ
Wafer Scale Integration

DRAM Testing

Samsung Semiconductor

Microcontrollers

Multi-Source (Support for Multiple IC Manufacturers)
Motorola

Prototyping Boards, Adapters & Extender Cards

Extender Cards

Prototyping Boards (Printed Circuit Boards Only - User Configurable)

Prototyping Adapters (Fully Assembled)

QFN/MLF 3-in-1 Adapter System

The QFN/MLF 3-in-1 Adapter System allows QFN/MLF programming, probing or emulation.

Sockets & Socket Receptacles

Socket Receptacles

Socket Receptacles allow sockets to be "socketed" and easily placed onto & removed from the PCB for reuse and cost savings.

Test & Burn-In Sockets

Test & Burn-In Sockets are through-hole mounted and typically use a clamshell or open-top lid.

ET Development Sockets are economical high-performance sockets targeted to the R&D phase of IC or system design and development.

Custom Development Sockets Our "Custom Development Sockets" are custom designed to meet your requirements. These sockets are available for all package styles: uBGA, BGA, CSP, MLF/QFN, SOP, QFP, modules, die and custom packages. They are available for any package size, pin/ball count and pitch down to 0.3mm. The socket's contact element is optimized for the application. Various contact elements are available: pogo-pin, elastomer, capped spring, PCB embedded contact, etc. Custom designs give a multitude of options, including higher bandwidths, lower contact forces, meeting z-height requirements, etc. Custom Development Sockets

Production Sockets

Production Sockets are meant to socket the IC in the end application. Some benefits are to allow field upgrades, eliminate the need to solder the IC after the assembly has been made, etc.

BPE BGA Socket Bases FPA BGA Socket Pin-Fields (top-side pads receive BGA) FPA-BL BGA Socket Pin-Fields (top-side pads with solder balls receive BGA) XPA BGA Socket Extended Length Pin-Field (top-side pads receive BGA)